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SMART InspEction system for High Speed and multifunctional testing of MEMS and MOEMS

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What can SMARTIEHS do for you?

SMARTIEHS develops a major breakthrough in M(O)EMS-testing realising a system for parallel test and in some cases calibration of all M(O)EMS structures on the wafer level.

SMARTIEHS lets test equipment producers and M(O)EMS producers meet around a revolutionary new testing concept. The SMARTIEHS test system concept is an inspection system built on a shared technology platform. Standard micro technology routines as wafer mounting and wafer-to-wafer alignment known from standard lithography equipment are applied. This design approach is chosen to consistently reduce development and inspection system costs. Thus this research project can be attractive both for test systems providers and for their customers.

Micro(Opto)ElectroMechanicalSystems, M(O)EMS are produced by silicon machining on Silicon wafers each containing from tens up to more than thousand devices. A way to significantly increase the throughput rate and cost efficiency of the microsystems manufacturing value chain is a parallel approach to the testing process where several or all M(O)EMS structures are tested within a single measurement cycle. This requires an overall understanding of the whole value chain (design, materials, processes, micro-/nano-scale devices, packaging testing and reliability) along with a sharp focus on the testing segment and an ambitious goal of introducing intelligence in it.

The sensitivity of the microscopic M(O)EMS structures implies the use of non-contact methods when measuring non-electrical parameters. Optical, non-intrusive and non-tactile methods are well suited for this purpose. Optical microscopy combined with interferometry is a versatile tool for the characterisation of the static and dynamic behaviour of M(O)EMS.

Interferometry is based on the wave properties of the light. A light beam is divided into a reference and an object beam. The beams are reflected back and combined in a beam combiner. The two waves interfere and form a fringe pattern. The pattern shows the difference in the optical path length between the reference and the object arm and is coded by the wavelength of the light. Parameters as shape and deformation of the object can be measured. Also periodic movements of the surface can thus be detected and quantified.

SMARTIEHS develops a major breakthrough in M(O)EMS-testing realising a system for parallel test and in some cases calibration of all M(O)EMS structures on the wafer level.

Parallel inspection is enabled by an array of micro-optical interferometers. The probing wafer will be aligned with the M(O)EMS wafer and will be able to inspect in a 10-by-10 matrix 100 MEMS structures at a time. The wafer is exchangeable and tailor made for the specific application. SMARTIEHS aims at producing this wafer based on a "standard design" for the different applications so that it may be scaled in production to match the size and the distribution of the MEMS/MOEMS structures on the M(O)EMS wafer.

Furthermore the inspection system consists of an imaging wafer containing DOE or microlenses. It images the interferometer output to the detector array. A 1000x1000 smart pixel camera array concept is developed for detection. This array ensures the spatial resolution required for the inspection task. A full field image approach ensures short measurement time and stability avoiding the influence of long term drift (i.e. temperatures).


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