SMARTIEHS presented at EPoSS
SMARTIEHS was presented at this year's General Assembly and Annual Forum of EPoSS.
EPoSS' this year's General Assembly and Annual Forum (http://www.smart-systems-integration.org/public/news-events/events/annual-forum) was hold on 8th and 9th October 2009 at the Palazzo Vermexio in Syracuse, Sicily. The SMARTIEHS system was presented in a presentation of
K. Schjølberg-Henriksen and D.T. Wang "APPLICATION-SPECIFIC SMART SYSTEM INTEGRATION"
The vision ”more than Moore” for smart systems can be achieved by several approaches. The
optimal approach depends on the device and its application. Here, two essential components
for smart system integration are presented: Multichip integration exemplified by a tyre
pressure monitoring system (TPMS) and direct integration of piezoelectric actuators on micro
For the TPMS, the silicon pressure sensor needed the added functionality of a transceiver, a
microcontroller and a bulk acoustic resonator. Incorporating all necessary functionality in one
silicon chip was unfeasible. Instead, four individual chips were joined electrically and
mechanically using through-silicon vias (TSVs) and chip bonding. Different TSV and
bonding technologies were evaluated based on the requirements for the TPMS. The results of
the technology evaluation and the final solution will be presented in the talk.
Micro optical components typically need a displacement of 10-20 μm. This can be achieved
by integrating piezoelectric bending mode actuators directly on the optical components. Two
components based on this will be presented: A variable focus lens and a micro spectrometer.