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SMART InspEction system for High Speed and multifunctional testing of MEMS and MOEMS

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Invited presentation at Photonics Europe 2010 in Brussels

SMARTIEHS will give an invited presentation at the SPIE conference "Optical Micro- and Nanometrology" at the Photonics Europe in Brussels 12.-17.April 2010

The titel of the presentation is:

Next generation test equipment for micro-production  (Invited Paper)  
Paper 7718-14
Author(s): Kay Gastinger, SINTEF (Norway); Malgorzata Kujawinska, Warsaw Univ. of Technology (Poland); Uwe D. Zeitner, Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany); Jorge Albero, Univ. de Franche-Comté (France); Stephan Beer, Ctr. Suisse d'Electronique et de Microtechnique SA (Switzerland); Christoph Schaeffel, Institut für Mikroelektronik- und Mechatronik- Systeme gemeinnützige GmbH (Germany); Patrick Lambelet, Heliotis Inc. (Switzerland); Marco Pizzi, Techfab Ltd. (Italy)
The inspection step is one of the bottle necks in production of Micro(Opto)ElectroMechanicalSystems M(O)EMS. This is due to the serial approach of the inspection equipment. The instruments on market today inspect one MEMS structure at a time, with need for scanning over the entire wafer area. This is time consuming and the instruments are inflexible and expensive. The upcoming requirement of 100% production control in particular for safety related applications tightens this situation.

To remove this bottle neck the test equipment need to overcome the high ratio between required measurement resolution and wafer size (10e-3 to 10e-4). There are 3 possibilities to do this: (1) increase the field of view at high resolution to inspect several structures at the time and scan (2) inspect with a low resolution measurement system larger areas of the wafer, identify suspicious areas and inspect them with a second measurement system at higher resolution, or (3) use an adapted array of sensors and scan the whole array.

Solution 3 is suited for MEMS testing. The EU project SMARTIEHS develops a novel concept based on a wafer-to-wafer inspection approach. Exchangeable micro-optical probing wafers are adapted to the M(O)EMS wafer under test. Thus the measurement time can be reduced with a factor of more than 100 on an 8 inch wafer. Different parameters can be tested in the same test station by exchanging the probing wafers, which are produced by standard processes of micro production. The project develops two probing wafers based on interferometer arrays for dynamic MEMS testing.

The paper discusses the different approaches, introduces the design of the test station and presents the advancements compared to the state of the art within the following fields: interferometer design, micro optical production, smart pixel camera and mechanical design. Furthermore the first demonstrators are introduced and experimental results are presented.

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